design and speci? cations are each subject to change without notice. ask factory for the current technical speci? cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. metal film chip resistors, high reliability type e 1 r 2 a 3 3 4 a 5 e 6 b 7 1 8 0 9 2 10 v 11 metal film chip resistors product code size, power rating type: inches power rating 0.063 w 0.1 w 0.125 w 0.25 w temperature coefficient code r p e h k 10 10 ? / c (ppm/ c) 15 10 ? / c (ppm/ c) 25 10 ? / c (ppm/ c) 50 10 ? / c (ppm/ c) 100 10 ? / c (ppm/ c) resistance tolerance code w b d tolerance 0.05 % 0.1 % 0.5 % resistance value the first two digits are significant figures of resistance and the third one denotes number of zeros following. (ex.) 10 2:1k packaging methods code x v packaging type t.c.r. 2a : 0402 3a : 0603 6a : 0805 8a : 1206 punched carrier taping (2 mm pitch) punched carrier taping (4 mm pitch) era2a era3a era6a era8a a b t w l metal film chip resistors, high reliab ility type 0402, 06 03, 0805, 1206 type: era 2a, 3a, 6a, 8a features hi gh reliability ............... stable at hi gh temperature and humidity (85 c 85 %rh rated load, category temperature range : 55 to +155 c) hi gh accuracy .............. smal l resistance tolerance and temperature coef cient of resistance hi gh performance ......... low current noise, excellent non-linearity reference standard ...... iec 60115-8, jis c 5201-8, eiaj rc-2133a explanation of part numbers dimensions in mm (not to scale) construction protective coating alumina substrate electrode (inner) electrode (between) high reliability metal film electrode (outer) type (inches) dimensions (mm) mass (weight) [g/1000 pcs.] lwa b t era2a (0402) 1.00 ?.10 0.50 +0.10 0.15 ?.10 0.25 ?.10 0.35 ?.05 0.6 era3a (0603) 1.60 ?.20 0.80 ?.20 0.30 ?.20 0.30 ?.20 0.45 ?.10 2 era6a (0805) 2.00 ?.20 1.25 ?.10 0.40 ?.25 0.40 ?.25 0.50 ?.10 4 era8a (1206) 3.20 ?.20 1.60 ?.10 0.50 ?.25 0.50 ?.25 0.60 ?.10 8 ?.05 mar. 2009
metal film chip resistors, high reliability type design and speci? cations are each subject to change without notice. ask factory for the current technical speci? cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. fe w p 1 p 2 p 0 t a b tape running direction chip component sprocket hole compartment d 0 c a b w t ?0 ?0 0 20 40 60 80 100 120 140 160 0 180 ?0 85 c ?5 c 20 40 60 80 100 rated load (%) ambient temperature ( c) 155 c (1) rated co ntinuous working voltag e (rcwv) shall be de ter mined from rcwv= rated power re sis tance values , or limiting element voltage (max. rcwv ) list ed above, wh icheve r less. (2) overload (short-tim e overload) test voltage (sotv) shall be de termined from sotv=2.5 power rating or max. over load volt age list ed above which ev er less. (3) e96 series resistance values are also available. please contact us for details. ratings power derati ng curve for resistors operated in ambient temperatures above 85 c, powe r rating shall be derated in ac cor dance with the gure on the right. packaging methods (taping) standard quantity type kind of taping pitch (p 1 )quantity era2a punched carrier taping 2 mm 1 0000 pcs./reel era3a, 6a, 8a 4 mm 5 000 pcs./reel taping reel carrier taping type (inches) power rating at 85 c (w) limiting element voltage (maximum rcwv) (1) (v) maximum overload voltage (2) (v) type (detail) resistance tolerance (%) t.c.r. [ 10 ? / c (ppm/ c)] resistance range (3) ( ) category temperature range (o perating temperature range) (?) era2a (0402) 0.063 25 50 era2akd ?.5 ?00 10 to 43 (e24) ?5 to +155 era2aed ?.5 ?5 47 to 10 0 k (e24) era2aeb ?.1 era3a (0603) 0.1 75 150 era3ahd ?.5 ?0 10 to 43 (e24) era3aed ?.5 ?5 47 to 33 0 k (e24) era3aeb ?.1 era3apb ?.1 ?5 470 to 10 0 k (e24) era3arb ?.1 ?0 1 k to 100 k (e24) era3arw ?.05 era6a (0805) 0.125 100 200 era6ahd ?.5 ?0 10 to 43 (e24) era6aed ?.5 ?5 47 to 1 m (e24) ERA6AEB ?.1 era6apb ?.1 ?5 470 to 10 0 k (e24) era6arb ?.1 ?0 1 k to 100 k (e24) era6arw ?.05 era8a (1206) 0.25 150 300 era8ahd ?.5 ?0 10 to 43 (e24) era8aed ?.5 ?5 47 to 1 m (e24) era8aeb ?.1 dimensions (mm) type a b w f e 2a 0.67 ?.05 1.17 ?.05 8.00 ?.20 3.50 ?.05 1.75 ?.10 3a 1.10 ?.10 1.90 ?.10 6a 1.65 ?.15 2.50 ?.20 8a 2.00 ?.15 3.60 ?.20 dimensions (mm) p 1 p 2 p 0 d 0 t 2a 2.00 ?.10 2.00 ?.05 4.00 ?.10 1.50 +0.10 0.52 ?.05 3a 4.00 ?.10 0.70 ?.05 6a, 8a 0.84 ?.05 ? dimensions (mm) a b c 180.0 +0 60 min. 13.0 ?.0 ?.0 dimensions (mm) wt 9.0 ?.0 11.4 ?.0 aug. 2009
design and speci? cations are each subject to change without notice. ask factory for the current technical speci? cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. metal film chip resistors, high reliability type chip resistor c a b preheating peak heating temperature time type (inches) dimensions (mm) abc era2a(0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6 era3a(0603) 0.7 to 0.9 2 to 2.2 0.8 to 1 era6a(0805) 1 to 1.4 3.2 to 3.8 0.9 to 1.4 era8a(1206) 2 to 2.4 4.4 to 5.0 1.2 to 1.8 temp erature time preheating 140 c to 160 c 60 s to 120 s main heat ing above 200 c 30 s to 40 s peak 235 5 c max. 10 s temp erature time preheating 150 c to 180 c 60 s to 120 s main heat ing above 230 c 30 s to 40 s peak max. 260 ? max. 10 s for soldering f or lead-fre e soldering temp erature tim etemperaturetime preheating 140 c to 180 c 60 s to 120 s 150 c to 180 c 60 s to 120 s soldering 245 ?5 c 20 s to 30 s max. 260 c max. 10 s recommended soldering conditions recommendations and precautions are described below. recommended so ldering conditions for re ow for soldering (example : sn/pb) for lead-free soldering (example : sn/ag/cu) recommended soldering conditions for ? ow in case of ow soldering, the land width must be small er than the chip resistor width to properly control the sol der amount properly. generally, the land width should be 0.7 to 0.8 times (w) of the width of chip resistor. in case of re ow soldering, solder amount can be adjusted, there fore the land width should be set to 1.0 to 1.3 times chip resistor width (w). recommended land pattern safety precautions the following ar e precautions for individual products. please also refer to the precautions common to fixed resistors shown on page er2 of this catalog. 1. keep th e rated power and ambient temperature within the speci ed derating curve. * when positioning an d mounting metal film chip resistors (hereafter called the resistors), make allowance for the effect of heat generated through close contact between the resistors and neigh bor ing components and for the temp erature rise of adjacent heat-generating components. 2. if a transien t load (heavy load in a short time) like a pulse is expe cted to be applied, check and evaluate the operations of the resistors when installed in your products before use. when app lying pulses to the resistors, keep the pulse peak within the rated voltage. 3. do not us e halogen-based or other high-activity ux. otherwise, the residue may impair the resistors' per for mance and/or re liability. 4. when soldering with a soldering iron, never touch the resist ors' bodies with the tip of th e soldering iron. when using a soldering iron with a high temperature tip, nish soldering as quickly as possible (within three seconds at 350 c max.). 5. as the amount of applied solder becomes larger, the me chanical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. avoid applying an excessive amount of solder. 6. when the resistor s' protective coat ings are chipped, awed, or removed, th e characteristics of the resistors may be impaired. take special care not to apply mechanical shock during automatic mounting or cause damage during handling of the boards with the resistors mounted. 7. d o not appl y shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). otherwise, the resistors' protective coatings and bodies may be chipped, affecting their performance. 8. avoid excessive bend ing of printed circuit boards in order to protect the resistors from abnormal stress. 9. do no t immerse the resistors in solvent for a long time. befo re using solvent, carefull y check the effects of im mer sion. ?re ow soldering shall be performed a maximum of two times. ?please contact us for additional information when used in conditions other than those speci ed. ?please meas ure the temperature of the terminals and study every kind of solder and printed circuit board for solderability be fore ac tu al use. feb. 2009
? er3 ? safety precautions (common precautions for fixed resistors) when using ou r products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the speci? cations with us in advance. the design and speci? cations in this catalog are subject to change without prior notice. do not use the products beyond the speci? cations described in this catalog. this cata log explains the quality and performance of the products as individual components. be fore use, check and evaluate their operations when installed in your products. install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause th e loss of human life or other signi? cant damage, such as damage to vehicles (au to mo bile, train, vessel), traf? c lights, medical equipment, aerospace equipment, elec tric heating ap pli anc es, com bus tion/gas equipment, rotating equipment, and disaster/crime prevention equip ment. ? systems equipped with a protection circuit and a protection device ? systems equip ped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) precautions for use these products are designed and manufactured for general and stan dard use in general elec tron ic equipment (e.g. av equipm ent, home el ectric ap pli anc es, of? ce equipment, information and com mu ni ca tion equipment) these products are not intended fo r use in the following special conditions. be fore using the products, care ful ly check the effects on their quality and performance, and determine whether or not they can be used. 1. in liquid, such as water, oil, chemicals, or organic solvent 2. in direct sunlight, outdoors, or in dust 3. in salty air or air with a high concentration of corrosive gas, such as cl 2 , h 2 s, nh 3 , so 2 , or no 2 4. electric static discharge (esd) environment these components are sensitive to static electricity and can be damaged under static shock (esd). please take measures to avoid any of these environments. smaller componen ts are more sensitive to esd environment. 5. electromagnetic environment avoid an y environment where strong electromagnetic waves exist. 6. in an environment where these pr oducts cause dew condensation 7. s e a li n g o r c o ating of these products or a printed circuit board on which thes e products are mounted, with resin or othe r materials these products generate joule heat when energized. carefu lly position th ese products so that their he at will not affect th e other components. carefully position thes e products so that their temperatures will not exceed the category temperature range due to the effect s of neighboring heat-generating com po nents. do not mount or place heat-generating com po nents or in? ammables, such as vinyl-coated wires, near these products . note that non- cleaning solder, halogen-based highly active ? ux, or wate r-soluble ? ux may dete riorate the performance or reliab ility of the products. carefully select a ? ux cleaning agent fo r use after soldering. an unsuit able agent may deteriorate the performance or reliability. in particular, when using water or a water-soluble cleaning agent, be careful not to leave water res i dues. otherwise, the insulation performance may be deteriorated. (2) precautions for storage the performanc e of these products, including the solderability, is guar anteed for a year from the date of arrival at your company, provided that they remain packed as they were wh en delivered and stored at a temperature of 5 c to 35 c and a relative humidity of 45 % to 85 %. even wi thin the above guarantee periods, do not store these products in the fol low ing conditions. otherwise, their elec tri cal performance and/or solderability may be dete riorated, and the packaging materials (e.g. tap ing ma te ri als) may be de formed or dete riorated, resulting in mounting failures. 1. in salty air or in air with a high concentration of corrosive gas, such as cl 2 , h 2 s, nh 3 , so 2 , or no 2 2. in direct sunlight package ma rkings include the product number, quantity, and country of origin. in principle, the country of origin should be indicated in english. oct. 2007
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